Silicon Wafer - Making a Logic Chip - 2 Inch
About this Artwork:
The background image of this artwork is of the chips on the silicon wafer (in the bottom right corner of the display). The chip on this silicon wafer is actually a very simple circuit with two transistors. The circuits are Mullard FC131 logic chips produced in the mid-1960s. These chips are dual 4-input DTL NAND/NOR gates. Prior to logic chips, components such as transistors, diodes, resistors, inductors, and capacitors were created as individual packages and were soldered on to printed circuit cards. With logic chips, all components in the circuit were created at the same time, on one piece of silicon, and placed in one package. Diode-Transistor Logic, or DTL, was the first technology used in making logic chips. DTL used diodes and transistors to build logic gates and circuits. There are about 480 DTL Mullard FCH131 logic chips on this 1.5” silicon wafer. In the bottom right corner of the display is a dual-in-line package that would be the type used for an FCH131.
About Making Computer Chips:
Computer chips start out as ordinary sand, which is silicon dioxide. However, the silicon must be made very, very pure. The first step is to melt the sand, in a furnace that reaches about 3200o F, and mix with carbon. This first purification process creates 99% pure Silicon, a common output is Silicon Carbide. The Silicon Carbide is processed in a trichlorosilane distillation method to create 99.9999% pure silicon called polycrystalline silicon. The polysilicon is broken up into chunks. These chunks are melted in a crucible at about 2500o F. A silicon crystal seed is dipped in molten silicon and slowly drawn out to create a cylinder of silicon. These silicon cylinders are some of the purest crystals on the planet. Once the silicon cylinder is grown to the desired diameter, it is sawed into wafers. These wafers are polished to achieve a very flat mirror surface. Transistors, and other microelectronic parts, are built on the polished wafer in layers in a process called etching. The wafer is then sawed into its individual chips. Each chip is mounted in an electronic package that serves to protect it and connect it to the outside world. It has been said that computer chips are the greatest value-added product in the world. We essentially take a pile of sand and change it into thousands of dollars worth of computer chips.
The artwork is framed in an 8"x10" black shadow box frame, with glass. All framing materials are acid-free. A narrative about the artwork that includes the artist’s signature is placed on the back of the artwork.
Please note: The look of the artifacts in the artworks may vary, each piece is unique.